Power chips are linked to outside circuits through product packaging, and their performance depends on the assistance of the packaging. In high-power situations, power chips are usually packaged as power modules. Chip interconnection refers to the electric connection on the top surface area of the chip, which is generally light weight aluminum bonding cord in standard modules. ^
Traditional power component plan cross-section

Today, commercial silicon carbide power components still mainly utilize the product packaging modern technology of this wire-bonded typical silicon IGBT component. They encounter issues such as huge high-frequency parasitic parameters, not enough heat dissipation ability, low-temperature resistance, and inadequate insulation stamina, which restrict the use of silicon carbide semiconductors. The screen of outstanding efficiency. In order to fix these issues and fully exploit the substantial possible benefits of silicon carbide chips, numerous brand-new packaging innovations and services for silicon carbide power modules have actually arised in recent years.

Silicon carbide power module bonding technique

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding products have developed from gold cable bonding in 2001 to aluminum wire (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have created from gold cables to copper wires, and the driving pressure is expense decrease; high-power devices have actually established from light weight aluminum cords (strips) to Cu Clips, and the driving pressure is to improve product efficiency. The higher the power, the greater the requirements.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that utilizes a solid copper bridge soldered to solder to attach chips and pins. Compared with typical bonding packaging approaches, Cu Clip innovation has the adhering to advantages:

1. The connection between the chip and the pins is made from copper sheets, which, to a specific degree, changes the standard cord bonding approach between the chip and the pins. For that reason, a distinct bundle resistance worth, greater current flow, and better thermal conductivity can be gotten.

2. The lead pin welding area does not require to be silver-plated, which can fully save the price of silver plating and poor silver plating.

3. The product appearance is entirely consistent with normal items and is primarily used in servers, portable computers, batteries/drives, graphics cards, motors, power supplies, and other areas.

Cu Clip has two bonding techniques.

All copper sheet bonding approach

Both eviction pad and the Resource pad are clip-based. This bonding method is much more pricey and complex, however it can achieve much better Rdson and much better thermal impacts.

( copper strip)

Copper sheet plus wire bonding method

The source pad uses a Clip technique, and the Gate utilizes a Cable approach. This bonding approach is somewhat more affordable than the all-copper bonding approach, saving wafer area (appropriate to extremely little gateway areas). The procedure is less complex than the all-copper bonding method and can acquire better Rdson and better thermal impact.

Distributor of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding cu so4 2, please feel free to contact us and send an inquiry.

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